The UV 375nm 200mW Fiber-Coupled Laser Module—an industrial-grade UV light source engineered exclusively for solder mask curing in PCB (Printed Circuit Board) manufacturing. Integrating 375nm UV wavelength’s solder resist absorption optimization, 200mW stable output, precision fiber-coupled delivery, and production-line-ready reliability, this module delivers uniform, efficient curing for PCB solder masks, ensuring high adhesion, scratch resistance, and long-term performance of circuit boards.

Core Advantages for Solder Mask Curing

375nm UV Wavelength: Optimized for Solder Mask Polymerization375nm wavelength aligns precisely with the absorption peak of standard PCB solder mask resins (e.g., epoxy-based, acrylate-based), triggering rapid photopolymerization without overheating the substrate; reduces curing time by 30% compared to longer UV wavelengths, while minimizing thermal deformation of delicate PCB traces.

200mW Stable Output: Uniform Curing QualityDelivers CW mode output with lower power fluctuation, ensuring consistent energy density across the curing area; eliminates uneven curing, bubbles, or micro-cracks in solder masks, guaranteeing batch-to-batch consistency for high-volume PCB production.

Fiber-Coupled Flexibility: Adaptable to PCB Production LinesEquipped with UV-grade multimode silica fiber (core diameter 105μm/125μm optional, NA=0.22, coupling efficiency ≥85%); enables flexible beam routing to confined curing stations or moving PCB conveyors, adapting to inline or offline production layouts. Fiber length customizable (1–5m) to fit factory space constraints.

Key Applications

Primary Application: Solder mask curing for rigid PCBs, flexible PCBs (FPCs), and HDI (High-Density Interconnect) boards in electronics manufacturing.
Extended Applications: UV curing of conformal coatings, adhesive bonding in microelectronics, and small-scale photopolymer curing for electronic components, LDI exposure machine.