Powerful UV Laser Water Cooling 375nm 10W Fiber Coupled Laser Module for LDI Exposure Machine

The Powerful UV Laser Water Cooling 375nm 10W Fiber-Coupled Laser Module—an industrial-grade high-power solution engineered for high-throughput UV processing. Combining 375nm UV-A wavelength’s optimal material absorption, 10W ultra-stable output, and efficient water cooling system, this module delivers precise, continuous energy for demanding industrial applications requiring long-duration, high-intensity UV exposure.

Core Advantages for Industrial UV Processing

1. 375nm UV-A Wavelength: Universal Material Compatibility

• 375nm wavelength (±5nm tolerance) aligns with absorption peaks of epoxy/acrylic-based photoresists, solder masks, UV inks, and polymers—ensuring rapid photopolymerization without material degradation.
• Outperforms longer UV wavelengths (385nm/395nm) in curing efficiencyand shorter UV-C (≤280nm) in penetration depth (up to 100μm), ideal for thick-film curing and deep-layer material processing.
• Superior absorption on non-ferrous metals (copper, aluminum) and semiconductors for UV-induced surface modification and micro-structuring.

2. 10W High Power + Water Cooling: 24/7 Stable Operation

• 10W CW output with lower power fluctuation over 24 hours, delivering energy density ≥10,000mW/cm² at the fiber tip—reducing processing time by 80% compared to 2W modules.
• Efficient water cooling system with adjustable flow rateand temperature control (20°C~30°C), ensuring junction temperature ≤75°C during continuous operation.
• Eliminates thermal drift and power decay common with air-cooled high-power modules, supporting uninterrupted industrial production lines.

Key Industrial Applications

• PCB Manufacturing: High-speed solder mask curing (rigid PCBs, FPCs, HDI boards), photoresist exposure for fine-patterning.
• UV Curing: Conformal coating curing, UV inkjet printing, adhesive bonding in electronics/automotive assembly.
• Microfabrication: Precision structuring of polymers, glass, and thin films for MEMS, microfluidics, and semiconductor components.
• Material Processing: UV-induced surface modification (hydrophilic/hydrophobic treatment), polymer aging testing, and nanomaterial synthesis.
• 3D Printing: High-power light source for large-format SLA/DLP 3D printers, enabling fast curing of thick resin layers.